STK20C04-W25
vs
X20C04JMB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SIMTEK CORP
|
XICOR INC
|
| Package Description |
DIP, DIP28,.6
|
PLASTIC, LCC-32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
25 ns
|
300 ns
|
| JESD-30 Code |
R-PDIP-T28
|
R-PQCC-J32
|
| JESD-609 Code |
e0
|
|
| Length |
36.83 mm
|
13.97 mm
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
NON-VOLATILE SRAM
|
NON-VOLATILE SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
32
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
512X8
|
512X8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
3.55 mm
|
| Standby Current-Max |
0.00075 A
|
|
| Supply Current-Max |
0.085 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
11.43 mm
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
MINIMUM 100 YEARS OF DATA RETENTION
|
|
|
|
Compare STK20C04-W25 with alternatives
Compare X20C04JMB with alternatives