STK10C68-K45I vs U631H64BDC45G1 feature comparison

STK10C68-K45I Cypress Semiconductor

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U631H64BDC45G1 ZMDI

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIMTEK CORP ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code DIP DIP
Package Description DIP, DIP, DIP28,.3
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 45 ns
JESD-30 Code R-CDIP-T28 R-PDIP-T28
JESD-609 Code e0 e3
Length 35.56 mm 34.544 mm
Memory Density 65536 bit 65536 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.14 mm 4.57 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 3
Moisture Sensitivity Level 3
Package Equivalence Code DIP28,.3
Standby Current-Max 0.001 A
Supply Current-Max 0.075 mA

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Compare U631H64BDC45G1 with alternatives