STFLWARP11/PL
vs
STFLWARP11/PG
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
LCC
|
PGA
|
| Package Description |
PLASTIC, LCC-84
|
CERAMIC, PGA-100
|
| Pin Count |
84
|
100
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
10
|
10
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J84
|
S-CPGA-P100
|
| JESD-609 Code |
e0
|
e0
|
| Length |
29.305 mm
|
|
| Number of Terminals |
84
|
100
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
PGA
|
| Package Equivalence Code |
LDCC84,1.2SQ
|
PGA100M,13X13
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
3.94 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Width |
29.305 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, FUZZY COMPUTATION ACCELERATOR
|
MATH PROCESSOR, FUZZY COMPUTATION ACCELERATOR
|
| Base Number Matches |
1
|
1
|
|
|
|