SSTV16859G
vs
SSTV16859EC,557
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
5.50 MM, PLASTIC, FBGA-96
|
LFBGA, BGA96,6X16,32
|
Pin Count |
96
|
96
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
SSTV
|
SSTV
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
JESD-609 Code |
e0
|
e0
|
Length |
13.5 mm
|
13.5 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
3
|
|
Number of Bits |
13
|
13
|
Number of Functions |
1
|
1
|
Number of Terminals |
96
|
96
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA96,6X16,32
|
BGA96,6X16,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Propagation Delay (tpd) |
2.8 ns
|
2.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.5 mm
|
Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5.5 mm
|
5.5 mm
|
fmax-Min |
200 MHz
|
200 MHz
|
Base Number Matches |
1
|
1
|
Manufacturer Package Code |
|
SOT536-1
|
|
|
|
Compare SSTV16859G with alternatives
Compare SSTV16859EC,557 with alternatives