SSTV16859EC,557
vs
SSTV16859GX
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA96,6X16,32
5.50 MM, PLASTIC, FBGA-96
Pin Count
96
96
Manufacturer Package Code
SOT536-1
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTV
SSTV
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
JESD-609 Code
e0
e0
Length
13.5 mm
13.5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
13
13
Number of Functions
1
1
Number of Terminals
96
96
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA96,6X16,32
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
2.8 ns
2.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.4 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
5.5 mm
fmax-Min
200 MHz
200 MHz
Base Number Matches
1
2
Moisture Sensitivity Level
3
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