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SSTV16859G vs SSTV16859EC,551 feature comparison

SSTV16859G Fairchild Semiconductor Corporation

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SSTV16859EC,551 NXP Semiconductors

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description 5.50 MM, PLASTIC, FBGA-96 LFBGA,
Pin Count 96 96
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTV SSTV
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0
Length 13.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3
Number of Bits 13 13
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 2.8 ns 2.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
fmax-Min 200 MHz 200 MHz
Base Number Matches 1 1
Manufacturer Package Code SOT536-1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Logic » FF/Latches
Logic » FF/Latches

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Compare SSTV16859EC,551 with alternatives