Findchips: Compare SSTV16859EC/G,518 vs ICSSSTVA16859YG-T

SSTV16859EC/G,518 vs ICSSSTVA16859YG-T feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code	BGA	TSSOP
Package Description	LFBGA,	6.10 MM WIDTH, 0.50 MM PITCH, MO-153, TSSOP-64
Pin Count	96	64
Manufacturer Package Code	SOT536-1
Reach Compliance Code	unknown	compliant
Family	SSTV	SSTV
JESD-30 Code	R-PBGA-B96	R-PDSO-G64
Length	13.5 mm	17 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	13	13
Number of Functions	1	1
Number of Terminals	96	64
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	2.8 ns	2.6 ns
Seated Height-Max	1.5 mm	1.2 mm
Supply Voltage-Max (Vsup)	2.7 V	2.7 V
Supply Voltage-Min (Vsup)	2.3 V	2.3 V
Supply Voltage-Nom (Vsup)	2.5 V	2.5 V
Surface Mount	YES	YES
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	BALL	GULL WING
Terminal Pitch	0.8 mm	0.5 mm
Terminal Position	BOTTOM	DUAL
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	5.5 mm	6.1 mm
fmax-Min	200 MHz	210 MHz
Base Number Matches	1	1
Pbfree Code		No
Rohs Code		No
HTS Code		8542.39.00.01
JESD-609 Code		e0
Package Equivalence Code		TSSOP64,.32,20
Qualification Status		Not Qualified
Terminal Finish		TIN LEAD
	Logic » FF/Latches	Logic » FF/Latches