SSTV16859EC,557 vs ICSSTV16859BKLF feature comparison

SSTV16859EC,557 NXP Semiconductors

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ICSSTV16859BKLF Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code BGA
Package Description LFBGA, BGA96,6X16,32 VQCCN,
Pin Count 96
Manufacturer Package Code SOT536-1
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTV SSTV
JESD-30 Code R-PBGA-B96 S-XQCC-N56
JESD-609 Code e0 e3
Length 13.5 mm 8 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 13 13
Number of Functions 1 1
Number of Terminals 96 56
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LFBGA VQCCN
Package Equivalence Code BGA96,6X16,32 LCC56,.31SQ,20
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH CHIP CARRIER, VERY THIN PROFILE
Propagation Delay (tpd) 2.8 ns 2.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form BALL NO LEAD
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM QUAD
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 8 mm
fmax-Min 200 MHz 210 MHz
Base Number Matches 1 1

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