SSTUP32866EC/S
vs
SSTUB32866EC/G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
BGA
Package Description
LFBGA, BGA96,6X16,32
,
Pin Count
96
Manufacturer Package Code
SOT-536-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
32866
JESD-30 Code
R-PBGA-B96
JESD-609 Code
e1
Length
13.5 mm
Logic IC Type
D FLIP-FLOP
Number of Bits
25
Number of Functions
1
Number of Terminals
96
Operating Temperature-Max
85 °C
Operating Temperature-Min
Output Characteristics
OPEN-DRAIN
Output Polarity
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
Package Code
LFBGA
Package Equivalence Code
BGA96,6X16,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
1.8 ns
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Supply Voltage-Max (Vsup)
2 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL EXTENDED
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Trigger Type
POSITIVE EDGE
Width
5.5 mm
fmax-Min
450 MHz
Base Number Matches
1
2
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