SSTUH32864EC/G vs SSTUAF32868BHLFT feature comparison

SSTUH32864EC/G NXP Semiconductors

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SSTUAF32868BHLFT Integrated Device Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA CABGA
Package Description LFBGA, BGA96,6X16,32 LFBGA-176
Pin Count 96 176
Manufacturer Package Code SOT-536-1 BKG176
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU 32868
JESD-30 Code R-PBGA-B96 R-PBGA-B176
Length 13.5 mm 15 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 2 3
Number of Bits 14 28
Number of Functions 1 1
Number of Terminals 96 176
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32 BGA176,8X22,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 1.8 ns 1.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.55 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 6 mm
fmax-Min 450 MHz 410 MHz
Base Number Matches 4 2
Pbfree Code Yes
JESD-609 Code e1
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

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