SSTUAF32868BHLFT
vs
74SSTUBF32865ABKG8
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
CABGA
|
CABGA
|
| Package Description |
LFBGA-176
|
LFBGA, BGA160,12X18,25
|
| Pin Count |
176
|
160
|
| Manufacturer Package Code |
BKG176
|
BKG160
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
32868
|
SSTU
|
| JESD-30 Code |
R-PBGA-B176
|
R-PBGA-B160
|
| JESD-609 Code |
e1
|
e1
|
| Length |
15 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
BUS DRIVER
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Bits |
28
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
176
|
160
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA176,8X22,25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
1.9 ns
|
3 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.55 mm
|
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
6 mm
|
|
| fmax-Min |
410 MHz
|
410 MHz
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| Max Frequency@Nom-Sup |
|
410000000 Hz
|
| Max I(ol) |
|
0.008 A
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
100 mA
|
| Technology |
|
TTL
|
|
|
|
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