SSTUB32866EC/S
vs
SSTUB32866EC/G-T
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA, BGA96,6X16,32
|
LFBGA,
|
Pin Count |
96
|
96
|
Manufacturer Package Code |
SOT536-1
|
SOT536-1
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
32866
|
32866
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
Length |
13.5 mm
|
13.5 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Number of Bits |
25
|
25
|
Number of Functions |
1
|
1
|
Number of Terminals |
96
|
96
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA96,6X16,32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Propagation Delay (tpd) |
1.5 ns
|
1.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Max (Vsup) |
2 V
|
2 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5.5 mm
|
5.5 mm
|
fmax-Min |
450 MHz
|
450 MHz
|
Base Number Matches |
1
|
1
|
|
|
|
Compare SSTUB32866EC/S with alternatives
Compare SSTUB32866EC/G-T with alternatives