SSTUB32866EC/S
vs
SSTUG32866EC/G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA96,6X16,32
LFBGA,
Pin Count
96
96
Manufacturer Package Code
SOT536-1
SOT536-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
32866
32866
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
Length
13.5 mm
13.5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
25
25
Number of Functions
1
1
Number of Terminals
96
96
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
1.5 ns
1.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.5 mm
Supply Voltage-Max (Vsup)
2 V
2 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
5.5 mm
fmax-Min
450 MHz
550 MHz
Base Number Matches
1
1
Moisture Sensitivity Level
2
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare SSTUB32866EC/S with alternatives
Compare SSTUG32866EC/G with alternatives