SSTUAF32868AHLF
vs
ICSSSTUAF32868AHLFT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CABGA
BGA
Pin Count
176
176
Manufacturer Package Code
BKG176
Reach Compliance Code
compliant
compliant
ECCN Code
NLR
HTS Code
8542390000
8542.39.00.01
Samacsys Manufacturer
Renesas Electronics
JESD-30 Code
R-PBGA-B176
R-PBGA-B176
JESD-609 Code
e1
e1
Logic IC Type
BUS DRIVER
D FLIP-FLOP
Moisture Sensitivity Level
3
3
Number of Terminals
176
176
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA176,8X22,25
BGA176,8X22,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
3 ns
3 ns
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
1
Package Description
LFBGA, BGA176,8X22,25
Family
32868
Length
15 mm
Number of Bits
28
Number of Functions
1
Output Polarity
TRUE
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
Temperature Grade
COMMERCIAL
Terminal Pitch
0.65 mm
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
Width
6 mm
fmax-Min
410 MHz
Compare ICSSSTUAF32868AHLFT with alternatives