ICSSSTUAF32868AHLFT
vs
74SSTUBF32865ABKG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
CABGA
Package Description
LFBGA, BGA176,8X22,25
LFBGA-160
Pin Count
176
160
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
32868
32865
JESD-30 Code
R-PBGA-B176
R-PBGA-B160
JESD-609 Code
e1
e1
Length
15 mm
13 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
3
3
Number of Bits
28
28
Number of Functions
1
1
Number of Terminals
176
160
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA176,8X22,25
BGA160,12X18,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
3 ns
3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.3 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
6 mm
9 mm
fmax-Min
410 MHz
410 MHz
Base Number Matches
1
2
Manufacturer Package Code
BKG160
ECCN Code
EAR99
Output Characteristics
OPEN-DRAIN
Technology
CMOS
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