Findchips: Compare SSTUA32S865ET,557 vs SSTUA32864EC,518

SSTUA32S865ET,557 vs SSTUA32864EC,518 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	BGA	BGA
Package Description	TFBGA, BGA160,12X18,25	LFBGA,
Pin Count	160	96
Manufacturer Package Code	SOT802-2	SOT536-1
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	SSTU	SSTU
JESD-30 Code	R-PBGA-B160	R-PBGA-B96
JESD-609 Code	e0
Length	13 mm	13.5 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	28	25
Number of Functions	1	1
Number of Terminals	160	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Characteristics	OPEN-DRAIN
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TFBGA	LFBGA
Package Equivalence Code	BGA160,12X18,25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)	1.8 ns	1.8 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.2 mm	1.5 mm
Supply Voltage-Max (Vsup)	2 V	2 V
Supply Voltage-Min (Vsup)	1.7 V	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Finish	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	0.65 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	9 mm	5.5 mm
fmax-Min	450 MHz	450 MHz
Base Number Matches	1	1
	Logic » FF/Latches	Logic » FF/Latches