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SSTUA32864EC/G,557 vs SSTUM32865ET/G,518 feature comparison

SSTUA32864EC/G,557 NXP Semiconductors

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SSTUM32865ET/G,518 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description LFBGA, BGA96,6X16,32 TFBGA,
Pin Count 96 160
Manufacturer Package Code SOT536-1 SOT802-2
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B160
JESD-609 Code e1
Length 13.5 mm 13 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 2 2
Number of Bits 25 28
Number of Functions 1 1
Number of Terminals 96 160
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA96,6X16,32 BGA160,12X18,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Propagation Delay (tpd) 1.8 ns 1.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.15 mm
Supply Voltage-Max (Vsup) 2 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 9 mm
fmax-Min 450 MHz 450 MHz
Base Number Matches 1 1
Output Characteristics OPEN-DRAIN
Logic » FF/Latches
Logic » FF/Latches

Compare SSTUA32864EC/G,557 with alternatives

Compare SSTUM32865ET/G,518 with alternatives