SST39VF800A-70-4C-B3KE
vs
M29F800DB55ZA1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SILICON STORAGE TECHNOLOGY INC
NUMONYX
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA48,6X8,32
0.80 MM PITCH, TFBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
55 ns
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e1
Length
8 mm
9 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
256
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.7 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
2K
Standby Current-Max
0.00002 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
2
2
Additional Feature
BOTTOM BOOT BLOCK
Alternate Memory Width
8
Boot Block
BOTTOM
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