SST39VF402C-70-4C-UA
vs
MX26LV400TXEC-70
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MACRONIX INTERNATIONAL CO LTD
Package Description
DIE-43
LFBGA, BGA48,6X8,32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Boot Block
TOP
TOP
JESD-30 Code
R-XUUC-N43
R-PBGA-B48
Memory Density
8388608 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
43
48
Number of Words
524288 words
262144 words
Number of Words Code
512000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX16
256KX16
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
3 V
Standby Current-Max
0.00002 A
0.0001 A
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
BALL
Terminal Position
UPPER
BOTTOM
Type
NOR TYPE
NOR TYPE
Base Number Matches
1
1
Rohs Code
Part Package Code
BGA
Pin Count
48
Additional Feature
TOP BOOT BLOCK
Alternate Memory Width
8
Command User Interface
YES
Data Polling
YES
JESD-609 Code
e0
Length
8 mm
Number of Sectors/Size
1,2,1,7
Package Equivalence Code
BGA48,6X8,32
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.3 mm
Sector Size
16K,8K,32K,64K
Terminal Finish
TIN LEAD
Terminal Pitch
0.8 mm
Toggle Bit
YES
Width
6 mm
Compare SST39VF402C-70-4C-UA with alternatives
Compare MX26LV400TXEC-70 with alternatives