SST39VF1601C-70-4C-EKE vs MBM29DL164TE-70TN feature comparison

SST39VF1601C-70-4C-EKE Microchip Technology Inc

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MBM29DL164TE-70TN FUJITSU Limited

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC FUJITSU LTD
Part Package Code TSOP1 TSOP1
Package Description TSOP-48 TSOP1, TSSOP48,.8,20
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Factory Lead Time 7 Weeks
Samacsys Manufacturer Microchip
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM TOP
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3 e0
Length 18.4 mm 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1
Number of Sectors/Size 1,2,1,31 8,31
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX16 1MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Equivalence Code TSSOP48,.8,20 TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Screening Level TS 16949
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 8K,4K,16K,32K 8K,64K
Standby Current-Max 0.00002 A 0.000005 A
Supply Current-Max 0.035 mA 0.05 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 12 mm 12 mm
Base Number Matches 2 3
Alternate Memory Width 8

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Compare MBM29DL164TE-70TN with alternatives