SST39VF040-70-4C-B3KE-T
vs
SST39VF040-70-4I-B3KE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Command User Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e1
e1
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Sectors/Size
128
128
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX8
512KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA48,6X8,32
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Sector Size
4K
4K
Standby Current-Max
0.000015 A
0.000015 A
Supply Current-Max
0.02 mA
0.03 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Base Number Matches
1
1
Part Package Code
BGA
Package Description
6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48
Pin Count
48
Length
8 mm
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Programming Voltage
2.7 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Width
6 mm
Compare SST39VF040-70-4C-B3KE-T with alternatives
Compare SST39VF040-70-4I-B3KE with alternatives