SST39VF020-90-4I-B3K
vs
SST39VF020-90-4C-NH
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SILICON STORAGE TECHNOLOGY INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
BGA
QFJ
Package Description
TFBGA, BGA48,6X8,32
QCCJ, LDCC32,.5X.6
Pin Count
48
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Command User Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PBGA-B48
R-PQCC-J32
JESD-609 Code
e0
e0
Length
8 mm
13.97 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
64
64
Number of Terminals
48
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
256KX8
256KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
QCCJ
Package Equivalence Code
BGA48,6X8,32
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
3.556 mm
Sector Size
4K
4K
Standby Current-Max
0.000015 A
0.000015 A
Supply Current-Max
0.03 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
J BEND
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
BOTTOM
QUAD
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
6 mm
11.43 mm
Base Number Matches
1
1
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