SST39VF020-90-4C-NH
vs
SST39VF020-90-4C-B3K
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SILICON STORAGE TECHNOLOGY INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
QFJ
BGA
Package Description
QCCJ, LDCC32,.5X.6
TFBGA, BGA48,6X8,32
Pin Count
32
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Command User Interface
YES
YES
Data Polling
YES
YES
JESD-30 Code
R-PQCC-J32
R-PBGA-B48
JESD-609 Code
e0
e0
Length
13.97 mm
8 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
64
64
Number of Terminals
32
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX8
256KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
TFBGA
Package Equivalence Code
LDCC32,.5X.6
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
1.2 mm
Sector Size
4K
4K
Standby Current-Max
0.000015 A
0.000015 A
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
BALL
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
11.43 mm
6 mm
Base Number Matches
1
1
Compare SST39VF020-90-4C-NH with alternatives
Compare SST39VF020-90-4C-B3K with alternatives