SST32HF1622C-90-4E-LFS vs S71PL064JA0BFW0Z0 feature comparison

SST32HF1622C-90-4E-LFS Silicon Storage Technology

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S71PL064JA0BFW0Z0 Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC SPANSION INC
Part Package Code BGA BGA
Package Description LFBGA, 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Pin Count 63 56
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANIZED AS 128K X 16 PSRAM IS ORGANIZED AS 1M X 16
JESD-30 Code R-PBGA-B63 R-PBGA-B56
Length 10 mm 9 mm
Memory Density 16777216 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 56
Number of Words 1048576 words 4194304 words
Number of Words Code 1000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -25 °C
Organization 1MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 7 mm
Base Number Matches 1 1
Rohs Code Yes
Access Time-Max 70 ns
JESD-609 Code e1
Mixed Memory Type FLASH+PSRAM
Moisture Sensitivity Level 3
Package Equivalence Code BGA56,8X8,32
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 40

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Compare S71PL064JA0BFW0Z0 with alternatives