SST29VE512-200-4C-WH vs X28C512KMB-90 feature comparison

SST29VE512-200-4C-WH Silicon Storage Technology

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X28C512KMB-90 Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Part Package Code TSOP1
Package Description TSOP1, PGA,
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 200 ns 90 ns
JESD-30 Code R-PDSO-G32 S-CPGA-P36
Length 12.4 mm 19.305 mm
Memory Density 524288 bit 524288 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 36
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX8 64KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSOP1 PGA
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V 5 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 4.88 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form GULL WING PIN/PEG
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL PERPENDICULAR
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 19.305 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 3
Screening Level MIL-STD-883

Compare SST29VE512-200-4C-WH with alternatives

Compare X28C512KMB-90 with alternatives