SST26VF064B-104I/S70S
vs
GD25Q64BFIGR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ELM TECHNOLOGY CORP
Package Description
DIE,
SOP-16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
104 MHz
120 MHz
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-XUUC-N
R-PDSO-G16
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
8
Number of Functions
1
1
Number of Ports
1
Number of Words
67108864 words
8388608 words
Number of Words Code
64000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX1
8MX8
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Equivalence Code
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
2.7 V
Screening Level
TS 16949
Serial Bus Type
SPI
Standby Current-Max
0.000045 A
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Type
NOR TYPE
NOR TYPE
Write Protection
HARDWARE
Base Number Matches
1
1
Length
10.3 mm
Number of Terminals
16
Seated Height-Max
2.75 mm
Terminal Pitch
1.27 mm
Width
7.52 mm
Compare SST26VF064B-104I/S70S with alternatives
Compare GD25Q64BFIGR with alternatives