GD25Q64BFIGR
vs
EN25QH64A-104XBIP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
ELM TECHNOLOGY CORP
ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGYINC
Package Description
SOP-16
HVSON, SOLCC8,.12,32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
120 MHz
104 MHz
JESD-30 Code
R-PDSO-G16
R-PDSO-N8
Length
10.3 mm
4 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
16
8
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.7 V
3 V
Seated Height-Max
2.75 mm
0.6 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
7.52 mm
3 mm
Base Number Matches
1
1
Rohs Code
Alternate Memory Width
1
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
Output Characteristics
3-STATE
Package Equivalence Code
SOLCC8,.12,32
Serial Bus Type
SPI
Standby Current-Max
0.00002 A
Supply Current-Max
0.035 mA
Write Protection
HARDWARE/SOFTWARE
Compare GD25Q64BFIGR with alternatives
Compare EN25QH64A-104XBIP with alternatives