SST26VF016-80-5I-QAE-UBX
vs
IS25LQ016B-JGLA2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
INTEGRATED SILICON SOLUTION INC
Package Description
WSON-8
TBGA,
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
80 MHz
104 MHz
JESD-30 Code
R-PDSO-N8
R-PBGA-B24
Length
6 mm
8 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
8
Number of Functions
1
1
Number of Terminals
8
24
Number of Words
16777216 words
2097152 words
Number of Words Code
16000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX1
2MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.7 V
3 V
Seated Height-Max
0.8 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
DUAL
BOTTOM
Width
5 mm
6 mm
Base Number Matches
1
1
Endurance
100000 Write/Erase Cycles
Package Equivalence Code
BGA24,4X6,40
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Serial Bus Type
QSPI
Supply Voltage-Nom (Vsup)
3 V
Time@Peak Reflow Temperature-Max (s)
30
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
Compare SST26VF016-80-5I-QAE-UBX with alternatives
Compare IS25LQ016B-JGLA2 with alternatives