IS25LQ016B-JGLA2
vs
IS25LP016D-JMLE-TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
TBGA,
SOP,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
104 MHz
133 MHz
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B24
R-PDSO-G16
Length
8 mm
10.31 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
16
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX8
2MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
SOP
Package Equivalence Code
BGA24,4X6,40
SOP16,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Programming Voltage
3 V
3 V
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
2.65 mm
Serial Bus Type
QSPI
QSPI
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Type
NOR TYPE
NOR TYPE
Width
6 mm
7.49 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Rohs Code
Factory Lead Time
12 Weeks
Date Of Intro
2018-06-22
Data Retention Time-Min
20
Output Characteristics
3-STATE
Standby Current-Max
0.00002 A
Supply Current-Max
0.025 mA
Compare IS25LQ016B-JGLA2 with alternatives
Compare IS25LP016D-JMLE-TR with alternatives