SST25VF010-20-4C-QAE-DD029
vs
W25X10LDACZ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Part Package Code
SON
DIP
Package Description
WSON-8
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
20 MHz
33 MHz
Data Retention Time-Min
100
20
JESD-30 Code
R-PDSO-N8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
6 mm
9.14 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVSON
DIP
Package Equivalence Code
SOLCC8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
4.45 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.0004 A
0.00001 A
Supply Current-Max
0.03 mA
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
5 mm
7.62 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
2
1
Pbfree Code
Additional Feature
SYNCHRONOUS MODE ALSO POSSIBLE
Endurance
100000 Write/Erase Cycles
Compare SST25VF010-20-4C-QAE-DD029 with alternatives
Compare W25X10LDACZ with alternatives