SSM2356CBZ-REEL7
vs
TS4984IQT
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
STMICROELECTRONICS
|
Part Package Code |
BGA
|
QFN
|
Package Description |
1.66 X 1.66 MM, ROHS COMPLIANT, WLCSP-16
|
4 X 4 MM, 0.50 MM PITCH, LEAD FREE, TQFN-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
Gain |
18 dB
|
|
Harmonic Distortion |
10%
|
1%
|
JESD-30 Code |
S-PBGA-B16
|
S-XQCC-N16
|
Length |
1.66 mm
|
4 mm
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
2 W
|
1 W
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
VFBGA
|
HVQCCN
|
Package Equivalence Code |
BGA16,4X4,16
|
LCC16,.16SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.66 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
1.66 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
STMicroelectronics
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Supply Current-Max |
|
12 mA
|
Terminal Finish |
|
Matte Tin (Sn) - annealed
|
|
|
|
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