SSM2335CBZ-R2
vs
MAX98310EWL+T
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
|
Package Description |
WLCSP-9
|
WLP-9
|
Pin Count |
9
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
20 kHz
|
22 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
Gain |
18 dB
|
9 dB
|
Harmonic Distortion |
10%
|
|
JESD-30 Code |
S-PBGA-B9
|
S-PBGA-B9
|
JESD-609 Code |
e3
|
e2
|
Length |
1.46 mm
|
0.965 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
4.28 W
|
2.7 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA9,3X3,20
|
BGA9,3X3,12
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.655 mm
|
0.69 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER NICKEL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.3 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
1.46 mm
|
0.965 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SSM2335CBZ-R2 with alternatives
Compare MAX98310EWL+T with alternatives