SSM2306CPZ-REEL7
vs
SSM2356CBZ-REEL7
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
BGA
|
| Package Description |
3 X 3 MM, ROHS COMPLIANT, MO-220VEED-2, LFCSP-16
|
1.66 X 1.66 MM, ROHS COMPLIANT, WLCSP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| Gain |
18 dB
|
18 dB
|
| Harmonic Distortion |
10%
|
10%
|
| JESD-30 Code |
S-XQCC-N16
|
S-PBGA-B16
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
1.66 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
2.4 W
|
2 W
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
0.66 mm
|
| Supply Voltage-Max (Vsup) |
5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
3 mm
|
1.66 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Package Equivalence Code |
|
BGA16,4X4,16
|
|
|
|
Compare SSM2306CPZ-REEL7 with alternatives
Compare SSM2356CBZ-REEL7 with alternatives