SSM2211CPZ-REEL7
vs
TPA2010D1YZF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ANALOG DEVICES INC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
BGA
Package Description
3 X 3 MM, ROHS COMPLIANT, LFCSP-8
VFBGA,
Pin Count
8
9
Manufacturer Package Code
CP-8-13
Reach Compliance Code
compliant
unknown
HTS Code
8542.33.00.01
8542.33.00.01
Samacsys Manufacturer
Analog Devices
Bandwidth-Nom
20 kHz
20 kHz
Consumer IC Type
CLASS D AUDIO AMPLIFIER
CLASS D AUDIO AMPLIFIER
JESD-30 Code
S-PDSO-N8
S-PBGA-B9
JESD-609 Code
e3
e1
Length
3 mm
1.75 mm
Moisture Sensitivity Level
3
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
8
9
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Power-Nom
1.5 W
2.5 W
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
VFBGA
Package Equivalence Code
SOLCC8,.11,20
BGA9,3X3,20
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.9 mm
0.625 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
TIN SILVER COPPER
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Width
3 mm
1.75 mm
Base Number Matches
1
1
ECCN Code
EAR99
Compare SSM2211CPZ-REEL7 with alternatives
Compare TPA2010D1YZF with alternatives