SSM2211CPZ-REEL7
vs
MAX98363AEWL+T
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
SOIC
|
9-WLCSP-N/A
|
Package Description |
3 X 3 MM, ROHS COMPLIANT, LFCSP-8
|
|
Pin Count |
8
|
9
|
Manufacturer Package Code |
CP-8-13
|
9-WLCSP-N/A
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.33.00.01
|
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
JESD-30 Code |
S-PDSO-N8
|
S-PBGA-B9
|
JESD-609 Code |
e3
|
e2
|
Length |
3 mm
|
1.528 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.5 W
|
3.2 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
VFBGA
|
Package Equivalence Code |
SOLCC8,.11,20
|
BGA9,3X3,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.9 mm
|
0.69 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
3 mm
|
1.528 mm
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2023-02-09
|
Supply Current-Max |
|
2 mA
|
|
|
|
Compare SSM2211CPZ-REEL7 with alternatives
Compare MAX98363AEWL+T with alternatives