SRM2B256SLCX10 vs MMCP-65656L55SHXXX feature comparison

SRM2B256SLCX10 Epson Electronics America Inc

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MMCP-65656L55SHXXX Atmel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer S-MOS SYSTEMS ATMEL CORP
Part Package Code DIP DIP
Package Description , DIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 180 ns 55 ns
JESD-30 Code R-PDIP-T28 R-CDIP-T28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -25 °C -55 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 3
Package Code DIP
Seated Height-Max 5.84 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare SRM2B256SLCX10 with alternatives

Compare MMCP-65656L55SHXXX with alternatives