SPNY801159
vs
AQR107-B0-IG-Y
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
AQUANTIA CORP
|
Package Description |
LEAD FREE, PLASTIC, QFP-128
|
LFBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
R-PQFP-G128
|
R-PBGA-B104
|
JESD-609 Code |
e3
|
|
Length |
20 mm
|
11 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
104
|
Operating Temperature-Max |
85 °C
|
108 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
LFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
3.4 mm
|
1.57 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
14 mm
|
7 mm
|
Base Number Matches |
1
|
2
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare SPNY801159 with alternatives
Compare AQR107-B0-IG-Y with alternatives