AQR107-B0-IG-Y
vs
KSZ8895RLXC
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
AQUANTIA CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
LFBGA,
|
LFQFP,
|
Reach Compliance Code |
unknown
|
compliant
|
JESD-30 Code |
R-PBGA-B104
|
S-PQFP-G128
|
Length |
11 mm
|
14 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
104
|
128
|
Operating Temperature-Max |
108 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFQFP
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
1.57 mm
|
1.6 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
7 mm
|
14 mm
|
Base Number Matches |
2
|
1
|
HTS Code |
|
8542.39.00.01
|
Date Of Intro |
|
2016-08-12
|
Package Equivalence Code |
|
QFP128,.63SQ,16
|
Screening Level |
|
TS 16949
|
|
|
|
Compare AQR107-B0-IG-Y with alternatives
Compare KSZ8895RLXC with alternatives