SPD5817
vs
BYV10-20143
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SOLID STATE DEVICES INC
NXP SEMICONDUCTORS
Package Description
HERMETIC SEALED PACKAGE-2
O-LALF-W2
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Application
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.55 V
JESD-30 Code
O-XALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Phases
1
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Output Current-Max
1 A
1 A
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
20 V
20 V
Reverse Recovery Time-Max
0.005 µs
Surface Mount
NO
NO
Technology
SCHOTTKY
SCHOTTKY
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
1
1
Compare SPD5817 with alternatives
Compare BYV10-20143 with alternatives