BYV10-20143 vs SPD5817TX feature comparison

BYV10-20143 NXP Semiconductors

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SPD5817TX Solid State Devices Inc (SSDI)

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS SOLID STATE DEVICES INC
Package Description O-LALF-W2 HERMETIC SEALED PACKAGE-2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-LALF-W2 O-XALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Output Current-Max 1 A 1 A
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 20 V 20 V
Surface Mount NO NO
Technology SCHOTTKY SCHOTTKY
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 1 1
Pin Count 2
Application GENERAL PURPOSE
Forward Voltage-Max (VF) 0.55 V
Non-rep Pk Forward Current-Max 25 A
Number of Phases 1

Compare BYV10-20143 with alternatives

Compare SPD5817TX with alternatives