SPC5777CSK3MMO3R
vs
SPC5777CLK3MME3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
MAPBGA-516
MAPBGA-416
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B516
S-PBGA-B416
Length
27 mm
27 mm
Number of Terminals
516
416
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
RAM (bytes)
524288
524288
ROM (words)
8388608
8388608
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.02 mm
2.02 mm
Speed
264 MHz
264 MHz
Supply Voltage-Max
1.32 V
1.32 V
Supply Voltage-Min
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Rohs Code
Factory Lead Time
12 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s)
40
Compare SPC5777CSK3MMO3R with alternatives
Compare SPC5777CLK3MME3 with alternatives