SPC5777CDK3MME3
vs
SPC5777CDK3MME3R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
MAPBGA-416
MAPBGA-416
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
12 Weeks
52 Weeks
Has ADC
YES
YES
Additional Feature
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B416
S-PBGA-B416
JESD-609 Code
e2
e2
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of Terminals
416
416
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
260
RAM (bytes)
524288
524288
ROM (words)
8388608
8388608
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.02 mm
2.02 mm
Speed
264 MHz
264 MHz
Supply Voltage-Max
1.32 V
1.32 V
Supply Voltage-Min
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Silver (Sn/Ag)
Tin/Silver (Sn/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Samacsys Manufacturer
NXP
Compare SPC5777CDK3MME3 with alternatives
Compare SPC5777CDK3MME3R with alternatives