SPC56EL70L3BBFR
vs
SPC564L70L3CBFY
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Package Description |
,
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
Number of I/O Lines |
57
|
57
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
RAM (bytes) |
196608
|
196608
|
ROM (words) |
2097152
|
262144
|
ROM Programmability |
FLASH
|
FLASH
|
Speed |
120 MHz
|
120 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Technology |
CMOS
|
CMOS
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
CPU Family |
|
E200Z4
|
JESD-30 Code |
|
S-PQFP-G100
|
Number of Terminals |
|
100
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
QFP
|
Package Equivalence Code |
|
QFP100,.63SQ,20
|
Package Shape |
|
SQUARE
|
Package Style |
|
FLATPACK
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
349 mA
|
Supply Voltage-Nom |
|
3.3 V
|
Surface Mount |
|
YES
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
|
|
|
Compare SPC56EL70L3BBFR with alternatives
Compare SPC564L70L3CBFY with alternatives