SPC56EL60L5CBOSY
vs
SPC5643LF2MLQ1R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B.4.A
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
30 Weeks
|
16 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
NXP
|
| Has ADC |
YES
|
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| CPU Family |
SPC56
|
|
| Clock Frequency-Max |
40 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
64
|
|
| JESD-30 Code |
S-PQFP-G144
|
|
| Length |
20 mm
|
|
| Number of I/O Lines |
16
|
|
| Number of Terminals |
144
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFQFP
|
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
131072
|
|
| ROM (words) |
1048576
|
|
| ROM Programmability |
FLASH
|
|
| Screening Level |
AEC-Q100
|
|
| Speed |
120 MHz
|
|
| Supply Current-Max |
311.6 mA
|
|
| Supply Voltage-Max |
3.63 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
20 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare SPC56EL60L5CBOSY with alternatives
Compare SPC5643LF2MLQ1R with alternatives