SPC5643LF2MLQ1R
vs
SPC564L60L5CBOSY
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
16 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| Moisture Sensitivity Level |
3
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
NO
|
| CPU Family |
|
SPC56
|
| Clock Frequency-Max |
|
40 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
64
|
| JESD-30 Code |
|
S-PQFP-G144
|
| Length |
|
20 mm
|
| Number of I/O Lines |
|
16
|
| Number of Terminals |
|
144
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFQFP
|
| Package Equivalence Code |
|
QFP144,.87SQ,20
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
131072
|
| ROM (words) |
|
1048576
|
| ROM Programmability |
|
FLASH
|
| Screening Level |
|
AEC-Q100
|
| Speed |
|
120 MHz
|
| Supply Current-Max |
|
311.6 mA
|
| Supply Voltage-Max |
|
3.63 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
20 mm
|
|
|
|
Compare SPC5643LF2MLQ1R with alternatives
Compare SPC564L60L5CBOSY with alternatives