SPC560C50L1B4E0Y
vs
SPC560C50L1C6E0X
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Clock Frequency-Max
16 MHz
16 MHz
DMA Channels
YES
YES
External Data Bus Width
Length
10 mm
10 mm
Number of I/O Lines
45
45
Number of Terminals
64
64
PWM Channels
YES
YES
Package Code
LFQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Speed
48 MHz
64 MHz
Supply Voltage-Max
5.5 V
3.6 V
Supply Voltage-Min
4.5 V
3 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
QFP
Package Description
10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-64
Pin Count
64
Additional Feature
ALSO OPERATES WITH 5 V NOMINAL SUPPLY
DAC Channels
NO
JESD-30 Code
S-PQFP-G64
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP64,.47SQ,20
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
RAM (bytes)
49152
ROM (words)
524288
ROM Programmability
FLASH
Seated Height-Max
1.6 mm
Supply Current-Max
140 mA
Temperature Grade
AUTOMOTIVE
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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