SPC5200CBV466BR2
vs
IDT79RV5000300BS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA272,20X20,50
LBGA, BGA272,21X21,50
Pin Count
272
272
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
64
Bit Size
32
64
Boundary Scan
YES
YES
Clock Frequency-Max
35 MHz
300 MHz
External Data Bus Width
32
64
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
NO
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e0
e0
Length
27 mm
29 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA272,20X20,50
BGA272,21X21,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
2.65 mm
1.65 mm
Speed
466 MHz
300 MHz
Supply Voltage-Max
1.58 V
3.465 V
Supply Voltage-Min
1.42 V
3.135 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
27 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
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