SPC5200CBV466BR2 vs IDT79RV5000180BS272 feature comparison

SPC5200CBV466BR2 Freescale Semiconductor

Buy Now Datasheet

IDT79RV5000180BS272 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA272,20X20,50 LBGA,
Pin Count 272 272
Reach Compliance Code not_compliant unknown
ECCN Code 3A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 64
Bit Size 32 64
Boundary Scan YES YES
Clock Frequency-Max 35 MHz 90 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
JESD-609 Code e0 e0
Length 27 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 272 272
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA272,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Seated Height-Max 2.65 mm 1.65 mm
Speed 466 MHz 180 MHz
Supply Voltage-Max 1.58 V 3.465 V
Supply Voltage-Min 1.42 V 3.135 V
Supply Voltage-Nom 1.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare SPC5200CBV466BR2 with alternatives

Compare IDT79RV5000180BS272 with alternatives