SPAK68882FN25A
vs
TS68882VR20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
THOMSON-CSF SEMICONDUCTORS
Part Package Code
LCC
PGA
Package Description
QCCJ,
CERAMIC, PGA-68
Pin Count
68
68
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
5
5
Boundary Scan
NO
NO
Bus Compatibility
MC68020; MC68030
Clock Frequency-Max
25 MHz
20 MHz
External Data Bus Width
32
32
JESD-30 Code
S-PQCC-J68
S-CPGA-P68
Length
24.2062 mm
26.92 mm
Number of Terminals
68
68
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
PGA
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
2.66 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
HCMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
J BEND
PIN/PEG
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
PERPENDICULAR
Width
24.2062 mm
26.92 mm
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
1
Compare SPAK68882FN25A with alternatives
Compare TS68882VR20 with alternatives