SP8853ACHC vs SP2002/B/AC feature comparison

SP8853ACHC Microsemi Corporation

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SP2002/B/AC Dynex Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MITEL SEMICONDUCTOR GEC PLESSEY SEMICONDUCTORS
Package Description QCCJ, LDCC28,.5SQ ,
Reach Compliance Code unknown unknown
JESD-30 Code S-XQCC-J28 S-CPGA-P68
JESD-609 Code e0 e0
Number of Terminals 28 68
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ
Package Equivalence Code LDCC28,.5SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER GRID ARRAY
Power Supplies 5 V
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max (Isup) 40 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form J BEND PIN/PEG
Terminal Pitch 1.27 mm
Terminal Position QUAD PERPENDICULAR
Base Number Matches 1 2
Analog IC - Other Type PLL FREQUENCY SYNTHESIZER
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SP8853ACHC with alternatives

Compare SP2002/B/AC with alternatives